PXR-750 Automatic BGA Rework System

BGA rework station is a high-precision hot air reflow soldering system specifically designed for BGA chip removal, reballing, and soldering. It simulates reflow soldering profiles through an independently temperature-controlled heating system and achieves micron-level alignment between the chip and pads via a vision alignment system. It is mainly used for the repair and small-batch production of precision electronic products such as mobile phone motherboards and graphics cards.
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Features


· Independent three-zone temperature control with precise regulation and adjustable thermal profiles, enabling integrated desoldering, reballing, and soldering processes.· Non-contact solder removal with real-time detection of PCBA warpage and adaptive nozzle height adjustment, ensuring zero damage to PCBA and pads.
· Equipped with a CCD optical alignment system for high-precision component placement.· Fully automatic system designed to support both repair and production applications.


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