Bus: sales@passioniot.com
Web: www.passioniot.com
Add:Building B, No. 28, Heshun Road, Suzhou Industrial Park
| · Fully Automated BGA Rework: Integrates automatic component removal, solder removal, solder paste dipping, component placement, and soldering into a single system, enabling fully automated BGA rework operations. |
| · Three Independent Heating Zones, Precise Temperature Control: Equipped with three independent high-power heating modules, the system enables zoned temperature control with powerful and stable heat output, meeting the demands of complex BGA rework processes. |
| · High-Precision Placement, Stable Soldering: Precisely controls BGA component removal and placement, combined with stable temperature control and soldering processes to ensure consistent and reliable rework quality. |
| · Reduced Manual Intervention, Enhanced Rework Efficiency: Automates key rework processes to minimize manual operations and operator-dependent variations, enabling more efficient and consistent BGA rework. |
Product Parameters
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| Item | Contents |
| Maximum PCBA size | 1000*750 mm (Expandable to 1000*1400 mm) |
| Maximum PCBA thickness | 15 mm |
| Maximum component range | 150*150 mm |
| Placement accuracy | ±10 μm |
| Camera resolution | 2000 W |
| Bottom area preheating Power | 24 kW |
| Top main heater power | 3.3 kW |
| Desoldering Heater Power | 1120 W |
| Local heater power | 3 kW |
| Temperature control accuracy | ±1 ℃ |
| Support maximum height of component at bottom of PCBA | 120 mm |
| Gas supply - Air | 0.6-0.8 MPa 2400 L/min |
| Gas supply - N2 | 0.5-0.6 MPa 200 L/min |
| Power supply | AC 380 V, 34 kW |
| Machine dimensions | 2100*1700*2000 mm |
| Machine weight | 1600 kg |